SpiderBond® Flex+ 150-90(25) is a thermoplastic hot melt polyamide adhesive based on dimer acid. It features easy moldability, good adhesion to a variety of substrates, excellent moisture resistance, excellent environmental resistance, and low viscosity. Applications include low pressure molding, allowing encapsulation of fragile components without damage. This adhesive is particularly suited to applications such as computer connections and memory sticks where high strength and hardness is required.
Detail or Method
°C Ring and Ball ASTM E 28
cps/mPa·s at 225°C LVT Brookfield ASTM D 3236
40% in n-Butanol, Gardner
°C, COC, ASTM D 6450
Storage: Store at room temperature in a dry area.
DOT Shipping Classification: Non-hazardous.
Packaging & Shipping:
Packaging: in double layer craft paper or woven compound bag
Delivery Detail: 15-25 days after receiving advanced T/T Payment
1. Samples sent to you free of charge
2. Delivery on time, quality according to customer request
3. OEM, ODM is welcome
4. Support small wholesale, retails. Any inquires will be replied within 24 hours