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Electronic Packaging Low Pressure Molding Polyamide Hot Melt Adhesive LPM 809

High temperature resistance, short open time, good chemical resistance, oil resistance. suitable for electronics low pressure molding.
  • LPM 809

  • SPIDERBOND

  • 350691

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SpiderBond® LPM 809 a thermoplastic hot melt adhesive based on polyamide. This product has the characteristics of good low temperature flexibility, good high temperature thermal stability, low water absorption and strong chemical resistance. The material has good adhesion.

This product has excellent electrical insulation and flame retardant, as well as excellent formability, low viscosity and high fluidity in molten state. This product is suitable for high temperature filter assembly, low pressure injection molding and other applications.

Material properties:

Color

Amber


Shape

Pellet


Density

0.98 g/cm3


Softening point

205±5°C

Ring and Ball ASTM E   28

Melting viscosity

230°C 2450 mPa.s

LVT Brookfield ASTM D   3236

Elongation at Break

≥600%

ISO 527

Hardness

48±5

Shore D

Open Time

1~5 s

ASTM D 4497

Glass Transition   Temperature (Tg)

-40°C

ASTM D 3111

Tensile Strength

13.8 MPa

ISO 527

Yield Strength

10.3 MPa

ISO 527

Volume Resistivity

3.74×1012   Ω.cm


Dielectric Constant

2.7


Application   temperature

230°C~250°C


Handling suggestions: 

When substrates with high heat conductivity shall be bonded the use of a given application temperature is necessary for good wetting. The substrate surface should be free of dust and cleaned with a suitable solvent so that there is no fat and oil.

Do not heat the product over the mentioned application temperature range. Without using do not heat the product for a long time, because the quality can decrease or extremely the product cokes. The standby temperature is 80 °C.

LPM 809 may adsorb moisture from the air. This will not be obvious in the solid form, but could cause foaming as the adhesive is melted which may result in poor bonds. Re close the container tightly as soon as sufficient adhesive has been removed for immediate use.


Apparatus cleaning: 

Remove very strong coked and not thermoplastic rests of hot melt mechanically.


Safety precautions: 

No health hazards are expected when this product is in solid form.

However, once melted it is like any hot liquid, which can produce severe burns. The appropriate safety precautions should be used (see also safety- data-sheet). If the molten adhesive has contacted your skin, cool the affected area immediately with cold water. Do not try to remove the adhesive from the skin. Go to your first aid station for attention.


Regulations: 

On the base of the available data, the product is not a hazardous material according to the China chemical law or the hazardous substances regulations.


Form of supply: 

Granulate, store in 25/20 kg net weight bag.


Storage: 

Up to max. +35 °C, min. 12 months in original closed container. Be sure that used container are closed immediately with insulation against moisture.

Maybe the adhesive and application properties can decrease by storing with open containers.

Information provided herein is based upon our practical knowledge and experience. Due to different materials used as well as to varying working conditions which are beyond our control we strictly recommend to carry out intensive trials. Any warranty and/or liability shall not be based on above information or personal consultation, except the contents of a consultation is explicitly confirmed by us in writing.



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