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Today we will share the softening point of hot-melt polyamide granule.
The softening point is the temperature at which the solvent granule begins to flow. It can be used as a general indicator to measure the heat resistance, melting difficulty and open time of the hot melt adhesive. It depends on the structure and molecular weight of the base polymer.
The softening point temperature is higher than the vitrification temperature, but there is no proportional relationship between them. Generally, the soluble adhesive with high softening point has good heat resistance, but the open time is short. However, the composition of different glues does not necessarily echo this law.
The softening point is usually determined by the ring and ball method.