The difference between hot sticking and cold sticking in hot melt adhesive

For hot melt adhesives, the difference between hot sticking and cold sticking is the difference in physical properties between the two states. From the description of the two bonding methods, the difference can be well understood, and it will be more convenient for the rubber to be used in the future.

1. Cold sticking

Cold sticking is encountered in many pressure sensitive hot melt applications. The seal of the more common courier bag is bonded by hot melt adhesive. Because you don't know when the courier bag will be used, you can apply the hot melt adhesive with the initial tackiness to solve the problem of ready-to-use. Moreover, the cold sticking does not have a glue overflow, and there is not much damage to the surface of the substrate. As long as the adhesive layer is in contact with the substrate and the bonding position is lightly pressed, the adhesive layer can be tightly adhered to the substrate, and the tear can not be pulled off.

2. Hot sticking

Hot sticking is common in applications such as wood edge banding, book binding, and carton bottoming. Similar substrates have certain requirements for the adhesion of hot melt adhesives. PSA (pressure-sensitive adhesive) does not achieve the desired bonding effect. Therefore, the hot bonding method is used to strengthen the degree of fusion between the colloid and the substrate. The texture and slits on the surface of the board leave a space between the glue layer and the substrate. The gap will contact the moisture and dust in the air, which greatly reduces the adhesion of the hot melt adhesive to the substrate. Over time, the glue layer will break away. Therefore, by heating the melted glue, the fine seam on the surface of the substrate can be well filled, and the glue can be more perfectly contacted with the substrate, thereby improving the bonding effect.

3. The difference between hot sticking and cold sticking

Hot sticking and cold sticking solves the problem in different adhesive applications. The difference in application is the activity of the glue molecules. The hot melt adhesive is used in a cold-bonded state, the glue liquid has been cooled to become a solid, its molecular structure has become relatively stable, and it is convenient to use for pasting. The use of hot melt adhesive in a hot-bonded state becomes active due to its molecular heating, has the ability to impact the molecular structure of the surface of the substrate, and even fuses with the molecular structure of the substrate, so that hot-bonded is more likely to damage the surface of the substrate.

There are few substrates that can be used with both hot and cold tacks, and there is no need to wonder and choose between these two adhesive methods. As long as you understand the sensitivity of the substrate to hot melt adhesives, you know what is the best way to apply the glue.

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